DESIGN SPECIFICATIONS: DIMENSIONS EXPLODED VIEW

INFO SPECS PROTOTYPE   SOFTWARE ANIMATION
EXTERIOR VIEWS

ELECTRONIC PACKAGING ADVANTAGES

  1. Polyimide head has antennaes cast into it for two-way data radio and telephone transmission. Antennae radiation only from head. Corner stop discourages hand holding up there.
  2. Multichip module design has user-changeable components
  3. Mounting holes, bottom is flat to 90 degrees from keyboard (units stands on its own)
  4. Backsides of the multichip modules disspate heat thru the aluminum backshell
  5. One-piece inctegrated inner flexcircuit made of kapton (polyimide) and sandwich laminated FR-4 (fiberglas, or other composite) printed circuit board. Backed and edged with advanced rubber, bonded to steel.
  6. Head display angle is adjustable.
  7. For waterproofness and serviceability, Gendex Biznex EPMO has lots of extra fasteners.